Display device and electronic device including the same

ABSTRACT

A display device may include a window module and a display module including a first non-folding region, a second non-folding region, and a folding region disposed between the first non-folding region and the second non-folding region. The display module may include a damping layer, a color filter layer, a display panel, and a lower member, which are sequentially stacked below the window module, and the damping layer may include polymer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This U.S. non-provisional patent application claims priority to and thebenefit of Korean Patent Application No. 10-2021-0077029 under 35 U.S.C.§ 119, filed on Jun. 14, 2021, in the Korean Intellectual PropertyOffice (KIPO), the entire contents of which are incorporated herein byreference.

BACKGROUND

The disclosure relates to an electronic device, and in particular, to afoldable electronic device.

A display device includes a display region which is activated by anelectrical signal applied thereto. The display device senses an input,which is provided from the outside through the display region, andprovides image information to a user through the display region. Asvarious types of display devices have been developed, the shape of thedisplay region has also been diversified.

SUMMARY

An embodiment of the disclosure provides a foldable display deviceincluding a digitizer with improved sensing sensitivity.

An embodiment of the disclosure provides a foldable display device withan improved impact-resistant property.

An embodiment of the disclosure provides a foldable display device whichhas high reliability even at low temperature.

According to an embodiment of the disclosure, a display device mayinclude a window module and a display module including a firstnon-folding region, a second non-folding region, and a folding regiondisposed between the first non-folding region and the second non-foldingregion. The display module may include a damping layer, a color filterlayer, a display panel, and a lower member. The damping layer, colorfilter layer, display panel, and lower member may be sequentiallystacked below the window module, and the damping layer may includepolymer.

In an embodiment, a thickness of the damping layer may be in a range ofabout 5 μm to about 30 μm.

In an embodiment, the window module may include a window protectionlayer and a thin glass substrate.

In an embodiment, a modulus value of the damping layer may be smallerthan a modulus value of the window protection layer.

In an embodiment, the display device may further include an upperadhesive layer, which is disposed directly on a bottom surface of thedamping layer. A thickness of the upper adhesive layer may be in a rangeof about 40 μm to about 60 μm.

In an embodiment, the display device may further include a panelprotection layer disposed below the display panel, and a lower adhesivelayer attaching the panel protection layer to the display panel. Athickness of the lower adhesive layer may be in a range of about 20 μmto about 30 μm.

In an embodiment, the lower member may include a support layer includinga nonmetal and a digitizer disposed below the support layer.

In an embodiment, the nonmetal may be a reinforced fiber.

In an embodiment, the damping layer may include at least one ofpolyimide, polycarbonate, polyamide, triacetylcellulose,polymethylmethacrylate, and polyethylene terephthalate.

In an embodiment, the lower member may include a penetration hole thatoverlaps at least one of the first non-folding region and the secondnon-folding region in a plan view. The display panel may overlap thepenetration hole in a plan view.

In an embodiment, the display device may further include an input sensordisposed between the color filter layer and the display panel.

According to an embodiment of the disclosure, a display device mayinclude a display panel including a first non-folding region, a secondnon-folding region, and a folding region, a color filter layer disposedon the display panel, the color filter layer including color filterpatterns and a division pattern, a damping layer disposed on the colorfilter layer, the damping layer including polymer, and a lower memberdisposed below the display panel.

In an embodiment, the lower member may include a penetration hole thatoverlaps at least one of the first non-folding region and the secondnon-folding region in a plan view. The display panel may overlap thepenetration hole in a plan view.

In an embodiment, the lower member may include a panel protection layerdisposed below the display panel, a support layer disposed below thepanel protection layer, the support layer including a nonmetal, and adigitizer disposed below the support layer.

In an embodiment, the nonmetal may be a reinforced fiber.

In an embodiment, a thickness of the damping layer may be in a range ofabout 5 μm to about 30 μm.

According to an embodiment of the disclosure, an electronic device mayinclude a display device including a first display region allowing fortransmission of an optical signal, a second display region adjacent tothe first display region, and a peripheral region adjacent to the seconddisplay region, and an electro-optical module disposed below the displaydevice and overlapping the first display region in a plan view, theelectro-optical module receiving the optical signal. The display devicemay include a window module and a display module including a firstnon-folding region, a second non-folding region, and a folding regiondisposed between the first non-folding region and the second non-foldingregion. The display module may include a damping layer, a color filterlayer, a display panel, and a lower member. The damping layer, colorfilter layer, display panel, and lower member may be sequentiallystacked below the window module. The damping layer may include polymer.

In an embodiment, the color filter layer may include color filterpatterns and a division pattern.

In an embodiment, a thickness of the damping layer may be in a range ofabout 5 μm to about 30 μm.

In an embodiment, the electro-optical module may include a cameramodule.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingbrief description taken in conjunction with the accompanying drawings.The accompanying drawings represent non-limiting, example embodiments asdescribed herein.

FIGS. 1A to 1C are schematic perspective views illustrating an assembledstructure of an electronic device according to an embodiment of thedisclosure.

FIG. 2A is a schematic exploded perspective view illustrating anelectronic device according to an embodiment of the disclosure.

FIG. 2B is a schematic block diagram illustrating an electronic deviceaccording to an embodiment of the disclosure.

FIG. 3 is a schematic cross-sectional view illustrating an electronicdevice according to an embodiment of the disclosure.

FIGS. 4A and 4B are cross-sectional views illustrating a window moduleaccording to an embodiment of the disclosure.

FIG. 5 is a schematic plan view illustrating a display panel accordingto an embodiment of the disclosure.

FIG. 6A is a schematic plan view illustrating a display panel accordingto an embodiment of the disclosure.

FIG. 6B is a cross-sectional view illustrating a display moduleaccording to an embodiment of the disclosure.

FIG. 7A is a cross-sectional view illustrating a display deviceaccording to an embodiment of the disclosure.

FIG. 7B is a cross-sectional view illustrating a display deviceaccording to an embodiment of the disclosure.

FIG. 8 is a schematic perspective view illustrating a support layeraccording to an embodiment of the disclosure.

FIG. 9A is a perspective view illustrating a portion of a support layeraccording to an embodiment of the disclosure.

FIG. 9B is a schematic perspective view illustrating a reinforced fiberaccording to an embodiment of the disclosure.

FIG. 9C is a schematic perspective view illustrating a portion of asupport layer according to an embodiment of the disclosure.

FIG. 10 is a schematic plan view illustrating a portion of a supportlayer according to an embodiment of the disclosure.

FIG. 11A is a schematic plan view illustrating a digitizer according toan embodiment of the disclosure.

FIG. 11B is a schematic plan view illustrating a sensing region of adigitizer according to an embodiment of the disclosure.

FIG. 11C is a cross-sectional view illustrating a sensing region of adigitizer according to an embodiment of the disclosure.

It should be noted that these figures are intended to illustrate thegeneral characteristics of methods, structure and/or materials utilizedin certain example embodiments and to supplement the written descriptionprovided below. These drawings are not, however, to scale and may notprecisely reflect the precise structural or performance characteristicsof any given embodiment, and should not be interpreted as defining orlimiting the range of values or properties encompassed by exampleembodiments. For example, the relative thicknesses and positioning ofmolecules, layers, regions and/or structural elements may be reduced orexaggerated for clarity. The use of similar or identical referencenumbers in the various drawings is intended to indicate the presence ofa similar or identical element or feature.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Example embodiments of the disclosure will now be described more fullywith reference to the accompanying drawings, in which exampleembodiments are shown. Example embodiments of the disclosure may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein; rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will convey the concept of example embodiments to those ofordinary skill in the art. In the drawings, the thicknesses of layersand regions are exaggerated for clarity. Like reference numerals in thedrawings denote like elements, and thus their description will beomitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Like numbers indicate like elementsthroughout. As used herein the term “and/or” includes any and allcombinations of one or more of the associated listed items. Other wordsused to describe the relationship between elements or layers should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon”).

It will be understood that, although the terms “first”, “second”, andthe like may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms (or meanings) as well, unless thecontext clearly indicates otherwise. It will be further understood thatthe terms “comprises”, “comprising”, “includes” and/or “including,” ifused herein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Example embodiments of the disclosure are described herein withreference to cross-sectional illustrations that are schematicillustrations of idealized embodiments (and intermediate structures) ofexample embodiments. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, example embodiments of thedisclosure should not be construed as limited to the particular shapesof regions illustrated herein but are to include deviations in shapesthat result, for example, from manufacturing.

The terms “about” or “approximately” as used herein is inclusive of thestated value and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” may mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

It will be understood that the terms “contact,” “connected to,” and“coupled to” may include a physical and/or electrical contact,connection, or coupling, and vice versa.

The phrase “at least one of” is intended to include the meaning of “atleast one selected from the group of” for the purpose of its meaning andinterpretation. For example, “at least one of A and B” may be understoodto mean “A, B, or A and B.”

Unless otherwise defined or implied herein, all terms (includingtechnical and scientific terms) used herein have the same meaning ascommonly understood by one of ordinary skill in the art to which exampleembodiments of the disclosure belong. It will be further understood thatterms, such as those defined in commonly-used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense unless expressly so defined herein.

FIGS. 1A to 1C are schematic perspective views illustrating an assembledstructure of an electronic device ED according to an embodiment. FIG. 1Aillustrates the electronic device ED in an unfolded state, and FIGS. 1Band 1C illustrate the electronic device ED in a folded state.

Referring to FIGS. 1A to 1C, the electronic device ED may include adisplay surface DS, which is disposed in a plane defined by twodifferent directions (e.g., a first direction DR1 and a second directionDR2). In the electronic device ED, the display surface DS may be used toprovide an image IM to a user.

The display surface DS may include a display region DA and a non-displayregion NDA around the display region DA. The display region DA may beused to display the image IM, and the non-display region NDA may not beused to display the image IM. The non-display region NDA may be providedto surround the display region DA. However, the disclosure is notlimited to this example, and the shape of the display region DA and theshape of the non-display region NDA may be variously changed.

The display region DA may include a first display region TA and a seconddisplay region NTA surrounding the first display region TA. The firstdisplay region TA may have higher optical transmittance than the seconddisplay region NTA and the non-display region NDA.

The first display region TA may be configured to allow for transmissionof natural light, visible light, or infrared light. The electronicdevice ED may further include a sensor that obtains or captures an imageof an external object from visible light passing through the firstdisplay region TA or determines proximity of an external object frominfrared light passing through the first display region TA.

In an embodiment, the first display region TA may be continuouslyextended from the non-display region NDA, without any gap regiontherebetween. In an embodiment, the display region DA may include firstdisplay regions TA.

Hereinafter, a direction perpendicular to both of the first and seconddirections DR1 and DR2 will be referred to as a third direction DR3.Furthermore, the phrase “when viewed in a plan view” or “in a plan view”in the specification will be used to describe a structure viewed in thethird direction DR3. Hereinafter, the first to third directions DR1,DR2, and DR3 may be directions indicated by first to third directionaxes, respectively, and will be identified with the same referencenumbers.

The electronic device ED may include a folding region FA and multiplenon-folding regions NFA1 and NFA2. The non-folding regions NFA1 and NFA2may include a first non-folding region NFA1 and a second non-foldingregion NFA2. In the second direction DR2, the folding region FA may bedisposed between the first and second non-folding regions NFA1 and NFA2.

As shown in FIG. 1B, the folding region FA may be folded along a foldingaxis FX parallel to the first direction DR1. The folding region FA mayhave a specific curvature or curvature diameter R1. The electronicdevice ED may be inner-folded so that the first and second non-foldingregions NFA1 and NFA2 face each other and the display surface DS is notexposed to the outside.

In an embodiment, the electronic device ED may be outer-folded so thatthe display surface DS is exposed to the outside. In an embodiment, theelectronic device ED may be configured to alternately and repeatedlyperform an unfolding operation and an inner-folding or outer-foldingoperation, but the disclosure is not limited to this example. In anembodiment, the electronic device ED may be configured to select one ofan unfolding operation, an inner-folding operation, and an outer-foldingoperation.

As shown in FIG. 1B, a distance between the first non-folding regionNFA1 and the second non-folding region NFA2 may be substantially equalto the curvature diameter R1, but as shown in FIG. 1C, the distancebetween the first non-folding region NFA1 and the second non-foldingregion NFA2 may be smaller than the curvature diameter R1. FIGS. 1B and1C are illustrated based on the display surface DS, and a case EDC(e.g., see FIG. 2A) forming an outer appearance of the electronic deviceED may include end portions, which contact each other at end regions ofthe first and second non-folding regions NFA1 and NFA2.

FIG. 2A is a schematic exploded perspective view illustrating theelectronic device ED according to an embodiment. FIG. 2B is a schematicblock diagram illustrating the electronic device ED according to anembodiment.

As shown in FIG. 2A, the electronic device ED may include a displaydevice DD, an electronic module EM, a power module PSM, a camera moduleCM, and a case EDC. Although not shown in the drawings, the power modulePSM may further include a mechanical structure that controls the foldingoperation of the display device DD.

The display device DD may be configured to produce or generate an imageand to sense an external input. An example of the external input is aninput provided from a user. The user's input may include various typesof external inputs such as a part of the user's body, a pen, light,heat, or pressure. The display device DD may include a window module WMand a display module DM. The window module WM may serve as the frontsurface of the electronic device ED. The window module WM will bedescribed in more detail below.

The display module DM may include a display panel DP. FIG. 2A shows anexample in which the display panel DP is illustrated as the only elementof the display module DM, but the display module DM may further includemultiple elements disposed on or below the display panel DP. Thestacking structure of the display module DM will be described in moredetail below.

The display panel DP may include an active region DP-DA and a non-activeregion DP-NDA corresponding to the display region DA and the non-displayregion NDA of the electronic device ED (see FIG. 1A). In thespecification, the phrase “a region or portion corresponds to anotherregion or portion” will be used to mean that they are overlapped with(or overlap) each other in a given direction (e.g., in a plan view), butthe two regions or portions may not have a same area.

The display module DM may include a driving chip DIC disposed on anon-display region DP-NDA. The display module DM may further include aflexible circuit film FCB coupled (or connected) to the non-displayregion DP-NDA. Although not shown in the drawings, the flexible circuitfilm FCB may be electrically connected to a main circuit board.

The active region DP-DA may include a first active region DP-TA and asecond active region DP-NTA corresponding to the first display region TAand the second display region NTA of the display module DM.

The first active region DP-TA may have higher transmittance than thesecond active region DP-NTA and the non-active region DP-NDA.

The driving chip DIC may include driving elements (e.g., a data drivingcircuit) that drive pixels of the display panel DP. FIG. 2A illustratesan example in which the driving chip DIC is mounted on the display panelDP, but the disclosure is not limited to this example. For example, thedriving chip DIC may be mounted on the flexible circuit film FCB.

The electronic module EM may include a control module 10, a wirelesscommunication module 20, an image input module 30, a sound input module40, a sound output module 50, a memory 60, and an outer interface module70. The modules may be mounted on the circuit board or may beelectrically connected to the circuit board through a flexible circuitboard. The electronic module EM may be electrically connected to thepower module PSM.

The control module 10 may be configured to control overall operations ofthe electronic device ED. For example, the control module 10 mayactivate or inactivate the display device DD, in accordance with auser's input. The control module 10 may control the image input module30, the sound input module 40, and the sound output module 50, inaccordance with a user's input. The control module 10 may include atleast one microprocessor.

The wireless communication module 20 may be configured to transmit andreceive a wireless signal to and from another terminal via a Bluetoothor a Wi-Fi line. The wireless communication module 20 may be configuredto transmit and receive a voice signal via a typical communication line.The wireless communication module 20 may include a transmitting circuit22, which is configured to modulate and transmit a signal to betransmitted, and a receiving circuit 24, which is configured todemodulate a received signal.

The image input module 30 may be configured to process an image signaland to convert it into image data that can be displayed on the displaydevice DD. The sound input module 40 may be configured to receive anexternal sound signal through a microphone in a recording mode or in avoice recognition mode and to convert the sound signal into electricalvoice data. The sound output module 50 may be configured to convertsound data, which is transmitted from the wireless communication module20 or is stored in the memory 60, and to output the converted sound datato the outside.

The outer interface module 70 may serve (or function) as an interfacethat is electrically connected to an external charger, a wired/wirelessdata port, a card socket (e.g., a memory card or a subscriberidentification module (SIM) or user identity module (UIM) card), and soforth.

The power module PSM may be configured to supply an electric powerrequired for the overall operation of the electronic device ED. Thepower module PSM may include a typical battery device.

An electro-optical module ELM may be an electronic component thatoutputs or receives an optical signal. The electro-optical module ELMmay transmit or receive the optical signal through the first displayregion TA (see FIG. 1A) and the first active region DP-TA. As anexample, the electro-optical module ELM may include the camera moduleCM. The camera module CM may receive natural light through the firstdisplay region TA (see FIG. 1A) and the first active region DP-TA andcapture an image of an external object by using the natural light.

However, the disclosure is not limited to this embodiment, and theelectro-optical module ELM may include a proximity sensor or an infraredsensor.

The electro-optical module ELM may overlap (or may be overlapped with)the first display region TA (see FIG. 1A) and the first active regionDP-TA. The electro-optical module ELM may be disposed in a lower regionof the display module DM.

The case EDC may contain the display module DM, the electronic moduleEM, and the power module PSM. The case EDC is illustrated to include twoseparate cases EDC1 and EDC2, but the disclosure is not limited to thisexample. Although not shown in the drawings, the electronic device EDmay further include a hinge structure, which is used to connect the twocases EDC1 and EDC2 to each other. The case EDC may be combined with thewindow module WM. The case EDC may protect the elements (e.g., thedisplay module DM, the electronic module EM, and the power module PSM)contained in the case EDC.

FIG. 3 is a schematic cross-sectional view illustrating the electronicdevice ED according to an embodiment of the disclosure. In detail, FIG.3 is a schematic cross-sectional view taken along line I-I′ of FIG. 1A.

Referring to FIG. 3 , the electronic device ED may include the windowmodule WM, the display module DM disposed below the window module WM,and the electro-optical module ELM. The display module DM may includethe display panel DP, an input sensor IS disposed on the display panelDP, a damping layer DL disposed on the input sensor IS, and a lowermember LM disposed below the display panel DP. In an embodiment, anadhesive layer may be disposed between adjacent ones of the elements.

The display panel DP may be one of light-emitting type display panels(e.g., an organic light-emitting display panel or a quantum dotlight-emitting display panel), but the disclosure is not limited to aspecific kind of display panel.

The input sensor IS may include sensing electrodes (not shown) thatsense an external input, trace lines (not shown) electrically connectedto the sensing electrodes, and an inorganic and/or organic layer thatprotects the sensing electrodes or the trace lines or prevents anelectric short issue between the sensing electrodes or the trace lines.The input sensor IS may be a capacitance-sensing-type sensor, but thedisclosure is not limited to this example.

The input sensor IS may be directly formed on an encapsulation layer ofthe display panel DP in a successive manner, during a fabricationprocess. In the specification, the display panel DP with the inputsensor IS will be referred to as an electronic panel EP. However, thedisclosure is not limited to the above example, and in an embodiment,the input sensor IS may be fabricated as a panel distinct from thedisplay panel DP and may be attached to the display panel DP by anadhesive layer.

In an embodiment, a penetration hole TA-T may be formed in a region ofthe electronic device ED. The penetration hole TA-T may be formed in thelower member LM, not in the display panel DP.

The penetration hole TA-T may be formed by stacking the elements shownin FIG. 3 and patterning the elements or may be formed by stackingelements with holes.

A region of the display device DD, in which the penetration hole TA-T isformed, may be defined as the first display region TA. The penetrationhole TA-T in the first display region TA may be used to emit or receivean optical signal or to display an image, if desired.

The electro-optical module ELM may be disposed in the penetration holeTA-T. For example, the electro-optical module ELM may be overlapped withthe first display region TA.

The damping layer DL may be disposed on the display panel DP. In detail,the damping layer DL may be disposed on the electronic panel EP. Thedamping layer DL may have a multi-layered structure or a single-layeredstructure.

The damping layer DL may be formed of or include polymer. For example,the damping layer DL may be formed of or include at least one ofpolyimide, polycarbonate, polyamide, triacetylcellulose,polymethylmethacrylate, and polyethylene terephthalate. For example, thedamping layer DL may be formed of or include polyethylene terephthalate.However, the disclosure is not limited to this example.

A modulus of the damping layer DL may have a value that is smaller thanor equal to a modulus of a window protection layer PF of the windowmodule WM which will be described below. Since the damping layer DLincludes polymer and has a modulus smaller than or equal to that of thewindow protection layer PF, the damping layer DL may have a goodflexibility property.

The damping layer DL may absorb an external impact exerted on the frontsurface of the electronic device ED. In detail, the damping layer DL maybe used to prevent the display panel DP from being deformed. Forexample, the damping layer DL may allow the display panel DP to have ahigh resistant property to a pressure by a fingernail or an impactcaused by a pen or the like. Accordingly, it may be possible to preventa failure or defect, such as a white spot issue, from occurring in thedisplay panel DP. In addition, it may be possible to prevent a portionof the electronic panel EP that is overlapped with the penetration holeTA-T, from hanging down by an external impact.

The following Table 1 summarizes mechanical properties of an electronicdevice including a damping layer (Embodiment 1) and an electronic devicewithout a damping layer (Comparative example 1).

The item “fingernail pressure” in Table 1 represents a force (kgf)corresponding to the largest value of a fingernail pressure which doesnot result in an imprinting failure in case that a pressure by afingernail is exerted on the electronic device.

The item “pen-impact resistance” in Table 1 represents the greatestheight of a pen which does not result in a failure in case that a pen isdropped on a top surface of an electronic device.

TABLE 1 Embodiment 1 Comparative example 1 Non-Folding FoldingNon-Folding Folding Evaluation Items Region Region Region RegionFingernail Pressure 12 7 12 3 (kgf) Pen-Impact 6 4 5 3 Resistance (cm)

Table 1 shows that the electronic device according to Embodiment 1 wasdesirable in terms of resistance to the fingernail pressure and the penimpact-resistant property, compared with Comparative Example 1.Especially, the resistant property to the fingernail pressure at thefolding region of Embodiment 1 was better than twice that at the foldingregion of Comparative Example 1. The pen impact-resistant property inEmbodiment 1 was better than that in Comparative Example 1, in both ofthe non-folding and folding regions. This shows that, in case that adamping layer including polymer is provided, the electronic device canhave an improved impact-resistant property. Especially, the electronicdevice can have desirable durability, even in case that there is apressure exerted from a fingernail or an impact caused by a pen. In anembodiment, a thickness of the damping layer DL in the third directionDR3 may range from about 5 μm to about 30 μm. For example, the thicknessof the damping layer DL may range from about 5 μm to about 25 μm (forexample, from about 10 μm to about 23 μm). In case that the thickness ofthe damping layer DL has the afore-described range, the foldingoperation of the electronic device ED at low temperatures may be morereadily performed. This will be described in more detail below.

The lower member LM may include various functional members. For example,the lower member LM may include a light-blocking layer preventing lightfrom being incident on the display panel DP, an impact absorption layerabsorbing an external impact, a support layer supporting the displaypanel DP, a heat-dissipation layer dissipating heat produced from thedisplay panel DP, and/or a digitizer sensing an external input. Thedisclosure is not limited to a specific stacking structure of the lowermember LM.

FIGS. 4A and 4B are schematic cross-sectional views illustrating thewindow module WM according to an embodiment of the disclosure.

Referring to FIGS. 4A and 4B, the window module WM may include a thinglass substrate UTG, the window protection layer PF disposed on the thinglass substrate UTG, and a bezel pattern BP disposed on a bottom surfaceof the window protection layer PF. In the embodiment, the windowprotection layer PF may include a plastic film. Accordingly, the windowmodule WM may further include an adhesive layer AL1 (hereinafterreferred to as a first adhesive layer) that attaches the windowprotection layer PF to the thin glass substrate UTG.

The bezel pattern BP may be overlapped with the non-display region NDAshown in FIG. 1A. The bezel pattern BP may be disposed on a surface ofthe thin glass substrate UTG or a surface of the window protection layerPF. FIG. 4A illustrates an example in which the bezel pattern BP isdisposed on a bottom surface of the window protection layer PF. However,the disclosure is not limited to this example, and in an embodiment, thebezel pattern BP may be disposed on a top surface of the windowprotection layer PF. The bezel pattern BP may be a coloredlight-blocking layer that is formed by, for example, a coating method.The bezel pattern BP may include a base material and dye or pigment thatis mixed in the base material.

In a plan view, the bezel pattern BP may correspond to the non-displayregion NDA shown in FIG. 1A. The bezel pattern BP may have a closed loopshape, in a plan view. A region, which is located inside an inner edgeB-IE of the bezel pattern BP, may correspond to the second displayregion NTA shown in FIG. 1A.

A thickness of the thin glass substrate UTG may range from about 15 μmto about 45 μm. The thin glass substrate UTG may be a chemicallystrengthened glass. By using the thin glass substrate UTG, it may bepossible to suppress occurrence of a crease, even in case that thefolding and unfolding operations are repeatedly performed.

A thickness of the window protection layer PF may range from about 50 μmto about 80 μm. The window protection layer PF may be formed of orinclude at least one of polyimide, polycarbonate, polyamide,triacetylcellulose, polymethylmethacrylate, and polyethyleneterephthalate. Although not shown in the drawings, at least one of ahard coating layer and an anti-fingerprint layer may be disposed on thetop surface of the window protection layer PF. A modulus of the dampinglayer DL may be equal to or smaller than a modulus of the windowprotection layer PF.

The first adhesive layer AL1 may be a pressure sensitive adhesive (PSA)film or an optically clear adhesive (OCA) film. In an embodiment, thefirst adhesive layer AL1 may include at least one of typical adhesiveagents. Other adhesive layers to be described below may havesubstantially identical or similar features to the first adhesive layerAL1.

The first adhesive layer AL1 may be detached from the thin glasssubstrate UTG. Since the window protection layer PF has a mechanicalstrength smaller than the thin glass substrate UTG, a scratch may easilyoccur on the window protection layer PF. In such a case, the firstadhesive layer AL1 and the window protection layer PF may be detachedfrom the thin glass substrate UTG, and a new window protection layer PFmay be attached to the thin glass substrate UTG.

In a plan view, an edge U-E of the thin glass substrate UTG may not beoverlapped with the bezel pattern BP. For example, the edge U-E of thethin glass substrate UTG may be exposed from (or not overlapped with)the bezel pattern BP, and thus, it may be possible to examine whetherthe edge U-E of the thin glass substrate UTG has a fine crack with aninspection apparatus.

In a plan view, the edge U-E of the thin glass substrate UTG may belocated between an edge P-E of the window protection layer PF and anouter edge B-OE of the bezel pattern BP. The edge U-E of the thin glasssubstrate UTG may be sufficiently exposed from the bezel pattern BP.

In a plan view, the edge P-E of the window protection layer PF may bealigned with an edge A-E of the first adhesive layer AL1. The windowprotection layer PF and the first adhesive layer AL1 may have a samearea and a same shape.

In an embodiment, referring to FIG. 4B, the outer edge B-OE of the bezelpattern BP may be aligned with the edge P-E of the window protectionlayer PF, in a plan view.

In an embodiment, the window protection layer PF may include a plasticresin layer disposed directly on a top surface of the thin glasssubstrate UTG. An insert molding method may be used to form the plasticresin layer that contacts the top surface of the thin glass substrateUTG. Before the formation of the plastic resin layer, the bezel patternBP may be formed on the top surface of the thin glass substrate UTG.Thus, the plastic resin layer may cover (or overlap) the bezel patternBP.

FIG. 5 is a schematic plan view illustrating the display panel DPaccording to an embodiment of the disclosure.

Referring to FIG. 5 , the display panel DP may include the active regionDP-DA and the non-active region DP-NDA.

The active region DP-DA and the non-active region DP-NDA may bedistinguishable from each other, based on whether a pixel PX is disposedtherein or not.

The pixel PX may be disposed in the active region DP-DA, and a scandriving portion SDV, a data driving portion, and an emission drivingportion EDV may be disposed in the non-active region DP-NDA. In anembodiment, the data driving portion may be a part of the driving chipDIC.

The active region DP-DA may include the first active region DP-TA andthe second active region DP-NTA, and the first active region DP-TA maybe a region whose resolution is lower than that of the second activeregion DP-NTA. For example, in case that four pixels per unit area aredisposed in the second active region DP-NTA, two pixels per unit areamay be disposed in the first active region DP-TA. A portion of the firstactive region DP-TA, in which the pixel is not disposed, may be used asa transmission path of an optical signal.

The display panel DP may include a first region AA1, a second regionAA2, and a bending region BA, which are distinct from each other in thesecond direction DR2. The second region AA2 and the bending region BAmay be a portion of the non-active region DP-NDA. The bending region BAmay be disposed between the first and second regions AA1 and AA2.

FIG. 5 illustrates the display panel DP in an unfolded state. In casethat the display panel DP is provided in the electronic device ED, thefirst and second regions AA1 and AA2 of the display panel DP may beplaced on different planes from each other, in case that the electronicdevice ED is in the unfolded state as shown in FIG. 1A. This will bedescribed in more detail with reference to FIGS. 7A and 7B.

The first region AA1 may be a region corresponding to the displaysurface DS of FIG. 1A. The first region AA1 may include a firstnon-folding region NFA10, a second non-folding region NFA20, and afolding region FA0. The first non-folding region NFA10, the secondnon-folding region NFA20, and the folding region FA0 may correspond tothe first non-folding region NFA1, the second non-folding region NFA2,and the folding region FA of FIGS. 1A to 1C, respectively.

The display panel DP may include pixels PX, scan lines SL1 to SLm, datalines DL1 to DLn, emission lines EL1 to ELm, first and second controllines CSL1 and CSL2, a power line PL, and pads PD, where each of m and nis a natural number.

The pixels PX may be electrically connected to the scan lines SL1 toSLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

The scan lines SL1 to SLm may be extended in the second direction DR2and may be electrically connected to the scan driving portion SDV. Thedata lines DL1 to DLn may be extended in the second direction DR2 andmay be electrically connected to the driving chip DIC via the bendingregion BA. The emission lines EL1 to ELm may be extended in the firstdirection DR1 and may be electrically connected to the emission drivingportion EDV.

The power line PL may include a portion that is extended in the seconddirection DR2, and a portion that is extended in the first directionDR1. The portion extended in the first direction DR1 and the portionextended in the second direction DR2 may be disposed on different layersfrom each other. A portion of the power line PL extending in the seconddirection DR2 may be extended to the second region AA2 via the bendingregion BA. The power line PL may be used to provide a first voltage tothe pixels PX.

The first control line CSL1 may be electrically connected to the scandriving portion SDV and may be extended toward a bottom end of thesecond region AA2 via the bending region BA. The second control lineCSL2 may be electrically connected to the emission driving portion EDVand may be extended toward the bottom end of the second region AA2 viathe bending region BA.

In a plan view, the pads PD may be disposed adjacent to the bottom endof the second region AA2. The driving chip DIC, the power line PL, thefirst control line CSL1, and the second control line CSL2 may beelectrically connected to the pads PD. The flexible circuit film FCB maybe electrically connected to the pads PD through an anisotropicconductive adhesive layer.

FIG. 6A is a schematic plan view illustrating the display panel DPaccording to an embodiment of the disclosure.

Referring to FIG. 6A, the active region DP-DA may include a first pixelEP1M, which is disposed in the first active region DP-TA, and a secondpixel EP2M, which is disposed in the second active region DP-NTA. Thefirst pixel EP1M and the second pixel EP2M may have light-emitting areasdifferent from each other and may be arranged in different shapes orforms. The first pixels EP1M may be provided in the first active regionDP-TA and may be arranged to be spaced apart from each other in thefirst and second directions DR1 and DR2.

Each of the first pixels EP1M may include sub-pixels E11M, E12M, andE13M.

(1-1)-th sub-pixels E11M may be spaced apart from each other in thesecond direction DR2 with (1-2)-th sub-pixels E12M interposedtherebetween, and a pair of the (1-1)-th sub-pixels E11M, which arespaced apart from each other, may be arranged in a diagonal direction,for example, a fourth direction DR4. In the embodiment, the (1-1)-thsub-pixels E11M may be configured to emit red light.

The (1-2)-th sub-pixels E12M may be disposed between the (1-1)-thsub-pixels E11M and (1-3)-th sub-pixels E13M. In the embodiment, each ofthe first pixels EP1M may include four (1-2)-th sub-pixels E12M whichare arranged in the first direction DR1 to be spaced apart from eachother. In the embodiment, the (1-2)-th sub-pixels E12M may be configuredto emit green light.

The (1-3)-th sub-pixels E13M may be spaced apart from each other in thesecond direction DR2 with the (1-2)-th sub-pixels E12M interposedtherebetween, and a pair of the (1-3)-th sub-pixels E13M, which arespaced apart from each other, may be arranged in a diagonal direction,for example, a fifth direction DR5. In the embodiment, the (1-3)-thsub-pixels E13M may be configured to emit blue light.

Light-emitting areas of the sub-pixels E11M, E12M, and E13M may beincreased in the order of the (1-2)-th sub-pixel E12M, the (1-3)-thsub-pixel E13M, and the (1-1)-th sub-pixel E11M. For example, thelight-emitting area of the (1-2)-th sub-pixel E12M may be smaller thanthat of the (1-3)-th sub-pixel E13M, and the light-emitting area of the(1-3)-th sub-pixel E13M may be smaller than that of the (1-1)-thsub-pixel E11M.

Each of the second pixels EP2M may include sub-pixels E21M, E22M, andE23M. The second pixels EP2M may be arranged to be spaced apart fromeach other in the first and second directions DR1 and DR2.

In the embodiment, the sub-pixels E21M, E22M, and E23M, which aredisposed in the second active region DP-NTA, may be arranged to form aPENTILE™ structure.

A (2-2)-th sub-pixel E22M may be spaced apart from a (2-1)-th sub-pixelE21M in the fourth direction DR4, and a (2-3)-th sub-pixel E23M may bespaced apart from the (2-1)-th sub-pixel E21M in the fifth directionDR5. The (2-3)-th sub-pixel E23M may be spaced apart from the (2-2)-thsub-pixel E22M in the second direction DR2.

The (2-1)-th sub-pixel E21M may have a rectangular shape whose sides areparallel to the fourth and fifth directions DR4 and DR5. In theembodiment, the (2-1)-th sub-pixel E21M may be configured to emit greenlight. The (2-1)-th sub-pixel E21M may have a diamond shape or rhombicshape.

The (2-2)-th sub-pixel E22M may have a square shape whose sides areparallel to the fourth and fifth directions DR4 and DR5. In theembodiment, the (2-2)-th sub-pixel E22M may be configured to emit bluelight. The (2-2)-th sub-pixel E22M may have a diamond shape or rhombicshape.

The (2-3)-th sub-pixel E23M may have a square shape whose sides areparallel to the fourth and fifth directions DR4 and DR5. In theembodiment, the (2-3)-th sub-pixel E23M may be configured to emit redlight. The (2-3)-th sub-pixel E23M may have a diamond or rhombic shape.

Light-emitting areas of the sub-pixels E21M, E22M, and E23M may beincreased in the order of the (2-1)-th sub-pixel E21M, the (2-2)-thsub-pixel E22M, and the (2-3)-th sub-pixel E23M. For example, thelight-emitting area of the (2-1)-th sub-pixel E21M may be smaller thanthat of the (2-2)-th sub-pixel E22M, and the light-emitting area of the(2-2)-th sub-pixel E22M may be smaller than that of the (2-3)-thsub-pixel E23M.

The first active region DP-TA may include an image region IA, a wiringregion WL, and a transmission region BT. The image region IA and thewiring region WL may be regions that are formed by patterning conductivematerials forming (or constituting) the pixel PX. The transmissionregion BT may be a region, through which light to be emitted from orreceived by the electro-optical module ELM passes. To prevent lightpropagating through the transmission region BT from being reflected bythe conductive materials, a light-blocking material may be furtherprovided in the image region IA and the wiring region WL.

FIG. 6B is a schematic cross-sectional view illustrating the displaymodule DM according to an embodiment.

FIG. 6B illustrates only some of elements forming (or constituting) thedisplay module DM. In an embodiment, the display module DM may includethe display panel DP, the input sensor IS disposed on the display panelDP, a color filter layer 300 disposed on the input sensor IS, and thedamping layer DL disposed on the color filter layer 300.

The display panel DP may include a base layer 110, a circuit layer 120,a light-emitting device layer 130, and an encapsulation layer 140.

The base layer 110 may be an element providing a base surface, on whichthe circuit layer 120 will be disposed. The base layer 110 may be arigid substrate or a flexible substrate which can be bent, folded, orrolled. The base layer 110 may be a glass substrate, a metal substrate,a polymer substrate, or the like.

The circuit layer 120 may be disposed on the base layer 110. The circuitlayer 120 may include an insulating layer, a semiconductor pattern, aconductive pattern, a signal line, and so forth.

In detail, the circuit layer 120 may include a buffer layer 10 br, firstto eighth insulating layers L10 to L80, and a semiconductor material,which are disposed on the base layer 110.

A first semiconductor pattern SP1 may be disposed on the buffer layer 10br.

A source region SE1, an active region AC1, and a drain region DE1 of asilicon transistor S-TFT may be regions of the first semiconductorpattern SP1.

The first insulating layer L10 may be disposed on the buffer layer 10br. The first insulating layer L10 may be overlapped in common withpixels and may cover (or overlap) the first semiconductor pattern SP1.The first insulating layer L10 may be an inorganic layer and/or anorganic layer and may have a single- or multi-layered structure. Thefirst insulating layer L10 may be formed of or include at least one ofaluminum oxide, titanium oxide, silicon oxide, silicon nitride, siliconoxynitride, zirconium oxide, and hafnium oxide. In the embodiment, thefirst insulating layer L10 may be a silicon oxide layer of asingle-layered structure. The first insulating layer L10 as well asinsulating layers of the circuit layer 120 to be described below may bean inorganic layer and/or an organic layer and may have a single- ormulti-layered structure. The inorganic layer may be formed of or includeat least one of the afore-described materials, but the disclosure is notlimited to this example.

A gate GT1 of the silicon transistor S-TFT may be disposed on the firstinsulating layer L10.

The second insulating layer L20 may be disposed on the first insulatinglayer L10 to cover (or overlap) the gate GT1. The third insulating layerL30 may be disposed on the second insulating layer L20. A secondelectrode CE20 of a storage capacitor Cst may be disposed between thesecond insulating layer L20 and the third insulating layer L30. A firstelectrode CE10 of the storage capacitor Cst may be disposed between thefirst insulating layer L10 and the second insulating layer L20.

A second semiconductor pattern SP2 may be disposed on the thirdinsulating layer L30. The second semiconductor pattern SP2 may includean active region AC2 of an oxide transistor O-TFT, which will bedescribed below. The second semiconductor pattern SP2 may be formed ofor include at least one of oxide semiconductor materials. The secondsemiconductor pattern SP2 may be formed of or include a transparentconductive oxide (TCO) (e.g., indium tin oxide (ITO), indium zinc oxide(IZO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), or indiumoxide (In₂O₃)).

A source region SE2, an active region AC2, and a drain region DE2 of theoxide transistor O-TFT may be formed from the second semiconductorpattern SP2.

The fourth insulating layer L40 may be disposed on the third insulatinglayer L30. In an embodiment, the fourth insulating layer L40 may be aninsulating pattern, which is overlapped with a gate GT2 of the oxidetransistor O-TFT and exposes the source region SE2 and the drain regionDE2 of the oxide transistor O-TFT.

The gate GT2 of the oxide transistor O-TFT may be disposed on the fourthinsulating layer L40. The gate GT2 of the oxide transistor O-TFT may bea region of a metal pattern. The gate GT2 of the oxide transistor O-TFTmay be overlapped with the active region AC2.

The fifth insulating layer L50 may be disposed on the fourth insulatinglayer L40 to cover the gate GT2. A first connection electrode CNE1 maybe disposed on the fifth insulating layer L50. The first connectionelectrode CNE1 may be electrically connected to the drain region DE1 ofthe silicon transistor S-TFT through a contact hole penetrating thefirst to fifth insulating layers L10, L20, L30, L40, and L50.

The sixth insulating layer L60 may be disposed on the fifth insulatinglayer L50. A second connection electrode CNE2 may be disposed on thesixth insulating layer L60. The second connection electrode CNE2 may beelectrically connected to the first connection electrode CNE1 throughthe contact hole penetrating the sixth insulating layer L60. The seventhinsulating layer L70 may be disposed on the sixth insulating layer L60to cover the second connection electrode CNE2. The eighth insulatinglayer L80 may be disposed on the seventh insulating layer L70.

Each of the sixth insulating layer L60, the seventh insulating layerL70, and the eighth insulating layer L80 may be an organic layer. Forexample, each of the sixth insulating layer L60, the seventh insulatinglayer L70, and the eighth insulating layer L80 may be formed of orinclude at least one of general-purpose polymers (e.g., benzocyclobutene(BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethylmethacrylate(PMMA), or polystyrene (PS)), polymer derivatives having a phenol-basedgroup, acryl-based polymers, imide-based polymers, arylether-basedpolymers, amide-based polymers, fluorine-based polymers, p-xylene-basedpolymers, vinylalcohol-based polymers, and blends thereof.

A first back-side metal layer BMLa may be disposed between the baselayer 110 and the buffer layer 10 br. The first back-side metal layerBMLa may be disposed below the silicon transistor S-TFT to prevent lightfrom being incident on a bottom surface of the silicon transistor S-TFT.

A second back-side metal layer BMLb may be disposed between the secondinsulating layer L20 and the third insulating layer L30. The secondback-side metal layer BMLb may be disposed below the oxide transistorO-TFT. The second back-side metal layer BMLb may prevent light frombeing incident on a bottom surface of the oxide transistor O-TFT. Thesecond back-side metal layer BMLb may be connected to a contactelectrode BML2-C, and may receive a constant voltage or a signal fromthe contact electrode BML2-C. The contact electrode BML2-C may belocated at the same level as that of the gate GT2 of the oxidetransistor O-TFT.

Each of the first back-side metal layer BMLa and the second back-sidemetal layer BMLb may be formed of or include at least one reflectivemetallic material. For example, each of the first back-side metal layerBMLa and the second back-side metal layer BMLb may be formed of orinclude at least one of silver (Ag), silver-containing alloys,molybdenum (Mo), molybdenum-containing alloys, aluminum (Al),aluminum-containing alloys, aluminum nitride (AlN), tungsten (W),tungsten nitride (WN), copper (Cu), and doped amorphous silicon.

The light-emitting device layer 130 may be disposed on the circuit layer120. The light-emitting device layer 130 may include an emission elementLD. For example, the emission element LD may include an organiclight-emitting material, an inorganic light-emitting material,organic-inorganic light-emitting material, quantum dots, quantum rods,micro-LEDs, or nano-LEDs.

The emission element LD may include a first electrode (or pixelelectrode) AE, an emission layer EL, and a second electrode (or commonelectrode) CE.

The first electrode AE may be disposed on the eighth insulating layerL80. The first electrode AE may be a (semi) transparent electrode or areflective electrode. In an embodiment, the first electrode AE of theemission element LD may include a reflection layer which is formed ofAg, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or compounds thereof, and atransparent or semitransparent electrode layer which is formed on thereflection layer. In an embodiment, the transparent or semitransparentelectrode layer may be formed of or include at least one materialselected from the group including (or consisting of) indium tin oxide(ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zincoxide (ZnO) or indium oxide (In₂O₃), and aluminum-doped zinc oxide(AZO). For example, the first electrode AE of the emission element LDmay have a structure, in which ITO, Ag, and ITO layers are stacked.

A pixel definition layer PDL may be disposed on the eighth insulatinglayer L80. The pixel definition layer PDL may be configured to have alight-blocking property.

Although not shown in the drawings, a hole control layer may be disposedbetween the first electrode AE and the emission layer EL. The holecontrol layer may include a hole transport layer and may further includea hole injection layer. An electron control layer may be disposedbetween the emission layer EL and the second electrode CE. The electroncontrol layer may include an electron transport layer and may furtherinclude an electron injection layer.

The encapsulation layer 140 may be disposed on the light-emitting devicelayer 130. The encapsulation layer 140 may include an inorganic layer141, an organic layer 142, and an inorganic layer 143 which aresequentially stacked, but the layers constituting the encapsulationlayer 140 are not limited to this example. The encapsulation layer 140may protect the light-emitting device layer 130 from a contaminationmaterial or foreign substances (e.g., moisture, oxygen, and dustparticles).

The input sensor IS may be disposed on the display panel DP. The inputsensor IS may be formed on the display panel DP in a successive manner.In this case, the input sensor IS may be disposed directly on thedisplay panel DP. The expression “the input sensor IS is disposeddirectly on the display panel DP” means that an additional element isnot disposed between the input sensor IS and the display panel DP.

The input sensor IS may include a base layer 210, a first conductivelayer 220, a sensing insulating layer 230, and a second conductive layer240.

The base layer 210 may be disposed directly on the display panel DP. Thebase layer 210 may be an inorganic layer containing at least one ofsilicon nitride, silicon oxynitride, and silicon oxide. As anotherexample, the base layer 210 may be an organic layer containing at leastone of epoxy resins, acrylic resins, and imide-based resins.

The first conductive layer 220 and the second conductive layer 240 mayinclude conductive lines that define a mesh-shaped sensing electrode.The conductive lines may not be overlapped with a first opening PDL-OPand may be overlapped with the pixel definition layer PDL.

The first and second conductive layers 220 and 240 may include a metallayer or a transparent conductive layer.

The metal layer may have a single-layered structure and may be formed ofor include at least one of molybdenum, silver, titanium, copper,aluminum, and alloys thereof. The transparent conductive layer mayinclude transparent conductive oxide such as indium tin oxide (ITO),indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide(IZTO). In an embodiment, the transparent conductive layer may include aconductive polymer (e.g., poly(3,4-ethylenedioxythiophene) (PEDOT)),metal nanowires, or graphene.

The conductive layer may have a multi-layered structure including metallayers. The metal layers may have a triple-layered structure including,for example, titanium/aluminum/titanium layers. The conductive layer ofthe multi-layered structure may include at least one metal layer and atleast one transparent conductive layer.

The sensing insulating layer 230 may be disposed between the firstconductive layer 220 and the second conductive layer 240. The sensinginsulating layer 230 may include an inorganic layer. The inorganic layermay be formed of or include at least one of aluminum oxide, titaniumoxide, silicon oxide, silicon nitride, silicon oxynitride, zirconiumoxide, and hafnium oxide.

As another example, the sensing insulating layer 230 may include anorganic layer. The organic layer may be formed of or include at leastone of acryl-based resins, methacrylate-based resins, polyisoprene-basedresins, vinyl-based resins, epoxy-based resins, urethane-based resins,cellulose-based resins, siloxane-based resins, polyimide-based resins,polyamide-based resins, and perylene-based resins.

The color filter layer 300 may be disposed on the input sensor IS. Thecolor filter layer 300 may include a division pattern 310, a colorfilter pattern 323, and a planarization layer 330.

In an embodiment, as long as a material has a light absorbing property,it may be used for the division pattern 310. The division pattern 310may be a layer of black color, and in an embodiment, the divisionpattern 310 may include a black coloring agent. The black coloring agentmay contain black dye or black pigment. The black coloring agent maycontain metallic materials (e.g., carbon black and chromium) or oxidesthereof.

The division pattern 310 may cover (or overlap) the second conductivelayer 240 of the input sensor IS. The division pattern 310 may prevent areflection issue of external light caused by the second conductive layer240.

A second opening 310-OP2 may be defined in the division pattern 310. Thesecond opening 310-OP2 may be overlapped with the first electrode AE ofthe emission element LD.

The color filter pattern 323 may be overlapped with the first electrodeAE. The color filter pattern 323 may cover (or overlap) the secondopening 310-OP2. The color filter pattern 323 may contact the divisionpattern 310.

The planarization layer 330 may cover the division pattern 310 and thecolor filter pattern 323. The planarization layer 330 may be formed ofor include an organic material and may have a flat top surface. In anembodiment, the planarization layer 330 may be omitted.

Since the color filter layer 300 includes the color filter patterns 323and the division pattern 310, it may reduce reflectance of externallight, which is incident thereon from the outside of the display deviceDD. The color filter patterns 323 may be arranged in a specific shape.For example, the color filter patterns 323 may be arranged inconsideration of light-emitting colors of the pixels included in thedisplay panel DP.

In an embodiment, the input sensor IS may be omitted. In this case, thecolor filter layer 300 may be disposed directly on the display panel DP.As another example, the positions of the input sensor IS and the colorfilter layer 300 may be exchanged.

The damping layer DL described above may be disposed on the color filterlayer 300. The display module DM may include the color filter layer 300,which is used instead of a polarization film. In this case, the dampinglayer DL may compensate an impact strength of the display module DM,which is lowered due to the absence of the polarization film. Since thedisplay module DM includes the color filter layer 300 and the dampinglayer DL, an impact-resistant property of the display module DM may bemaintained to an excellent level.

FIG. 6B illustrates some of elements forming the display module DM, andan adhesive layer may be disposed between the illustrated elements. Forexample, the adhesive layer may be disposed between the damping layer DLand the color filter layer 300. The adhesive layer will be described inmore detail below.

FIG. 7A is a schematic cross-sectional view illustrating the displaydevice DD according to an embodiment of the disclosure. FIG. 7B is aschematic cross-sectional view illustrating the display device DDaccording to an embodiment of the disclosure.

Referring to FIGS. 7A and 7B, the display device DD may include thewindow module WM and the display module DM. The window module WM may beone of the window modules WM described with reference to FIGS. 4A and4B, but the disclosure is not limited thereto.

The display module DM may include the damping layer DL, the displaypanel DP, a panel protection layer PPL, a barrier layer BRL, a supportlayer PLT, a cover layer SCV, a digitizer DTM, a metal layer ML, a metalplate MP, a heat-dissipation layer HRP, and fourth to tenth adhesivelayers AL4 to AL10. The second to tenth adhesive layers AL2 to AL10 mayinclude an adhesive agent (e.g., a pressure sensitive adhesive agent oran optically clear adhesive agent) and may have the same technicalfeatures as the first adhesive layer AU. In an embodiment, some of theafore-described elements may be omitted. For example, the metal plate MPor heat-dissipation layer HRP and the adhesive layer attached theretomay be omitted.

The damping layer DL may be disposed in the first region AA1. Thedamping layer DL may cover (or overlap) at least the active regionDP-DA. The second adhesive layer AL2 may be used to attach the dampinglayer DL to the window module WM.

The third adhesive layer AL3 (or an upper adhesive layer) may bedisposed directly on a bottom surface of the damping layer DL. Forconvenience in illustration, only the display panel DP is illustrated inFIG. 7A, but the color filter layer 300 and the input sensor IS may befurther disposed between the display panel DP and the third adhesivelayer AL3, as shown in FIG. 6B. In other words, the third adhesive layerAL3 may be used to attach the damping layer DL and the color filterlayer 300 to each other.

In an embodiment, a thickness of the third adhesive layer AL3 may rangefrom about 40 μm to about 60 μm (for example, from about 45 μm to about55 μm).

Since the electronic device ED includes the damping layer DL, which hasa thickness range of about 5 μm to about 30 μm and includes a polymericmaterial, and the third adhesive layer AL3, which has a thickness rangeof about 40 μm to about 60 μm, the electronic device ED may have animproved impact-resistant property.

The panel protection layer PPL may be disposed below the display panelDP. The panel protection layer PPL may protect a lower portion of thedisplay panel DP. The panel protection layer PPL may be formed of orinclude at least one of flexible plastic materials. For example, thepanel protection layer PPL may be formed of or include polyethyleneterephthalate. In an embodiment, the panel protection layer PPL may notbe disposed in the folding region FA. The panel protection layer PPL mayinclude a first panel protection layer PPL-1 protecting the first regionAA1 of the display panel DP and a second panel protection layer PPL-2protecting the second region AA2.

The fourth adhesive layer or lower adhesive layer AL4 may be used toattach the panel protection layer PPL to the display panel DP. Thefourth adhesive layer AL4 may include a first portion AL4-1corresponding to the first panel protection layer PPL-1 and a secondportion AL4-2 corresponding to the second panel protection layer PPL-2.A thickness of the fourth adhesive layer AL4 may range from about 20 μmto about 30 μm. For example, the thickness of the fourth adhesive layerAL4 may be about 25 μm. In case that the fourth adhesive layer AL4 hasthe thickness range, a modulus value of the fourth adhesive layer AL4may be lowered, and in this case, it may be possible to reduce a failureor defect, such as a delamination failure of the adhesive layer or acrack in the display panel, which may occur in case that the foldingoperation of the electronic device ED is performed at low temperatures.

The following Table 2 summarizes results of an experiment of evaluatinga low-temperature folding performance of an electronic device accordingto a thickness of a fourth adhesive layer and a thickness of theafore-described damping layer.

The item “Thickness of fourth adhesive layer” in Table 2 represents thethickness of the fourth adhesive layer AL4 described above.

The item “Thickness of damping/polarization layer” in Table 2 representsthe thickness of the damping layer DL described above and represents thethickness of the polarization layer in Comparative Example 4, in which apolarization layer is used instead of the damping layer.

The item “Lowest temperature” in Table 2 represents the lowesttemperature which does not cause a crack issue in the display panel incase that the folding operation of the electronic device is executed.The experiment was executed to examine whether a crack is formed in thedisplay panel DP while the folding operation of the electronic device isrepeated at an experiment temperature. The crack may be, for example, acrack formed in the encapsulation layer of the display panel DP.

Each of the electronic devices according to Embodiment 2 and ComparativeExamples 2 and 3 was prepared to include the fourth adhesive layer andthe damping layer and to have the thickness range given in Table 2.Except for the difference in thickness, the fourth adhesive layer andthe damping layer were provided to have the technical features describedabove. For example, the damping layer was disposed on the display panel,and the fourth adhesive layer was disposed between the display panel andthe panel protection layer.

The electronic device of Comparative Example 4 was prepared to includethe fourth adhesive layer and to include the polarization layer, insteadof the damping layer. The polarization layer and the damping layer wasdisposed at a same position (in detail, on the display panel).

An electronic device of a reference example was prepared to include thefourth adhesive layer, but not the damping layer and the polarizationlayer.

TABLE 2 Evaluation Embodiment Comparative Comparative ComparativeReference Items 2 Example 2 Example 3 Example 4 Example Thickness 25 2518 18 18 of fourth adhesive layer (μm) Thickness of 23 40 40 (31) —damping/ polarization layer (μm) Lowest −20 −15 −10 −15  −20 temperature (° C.)

Table 2 shows that the folding operation of the electronic deviceaccording to Embodiment 2 can be executed at a temperature of −20° C.,without damage to the display panel. For the electronic device accordingto embodiment 2, the folding operation was possible at a temperaturethat is lower than those in comparative examples 2, 3, and 4, withoutdamage to the display panel. The lowermost temperature in Embodiment 2was equal to the lowermost temperature in the reference example.

For the electronic device of the reference example, a reduced stress wasexerted on the display panel during the folding operation, because thedamping or polarization layer was not provided on the display panel.

For the electronic device according to an embodiment of the disclosure,since the fourth adhesive layer has a thickness range of about 20 μm toabout 30 μm and the damping layer has a thickness range of about 5 μm toabout 30 μm, the folding operation may be executed, without a failure,at the same temperature (for example, −20° C.) as that in the referenceexample. For example, although the electronic device according to anembodiment of the disclosure has the damping layer provided on thedisplay panel, a stress exerted on the display panel may be reduced, asin the electronic device of the reference example, in which the dampingor polarization layer is not provided.

Accordingly, the folding operation of the electronic device may haveimproved reliability at low temperatures.

In case that the bending region BA is bent as shown in FIG. 7B, thesecond panel protection layer PPL-2, along with the second region AA2,may be disposed below the first region AA1 and the first panelprotection layer PPL-1. Since the panel protection layer PPL is notdisposed in the bending region BA, the bending region BA may be morereadily bent.

The bending region BA may have a specific curvature or a specificcurvature radius. The curvature radius may range from about 0.1 mm toabout 0.5 mm. At least a portion of a bending protection layer BPL maybe disposed in the bending region BA. The bending protection layer BPLmay be overlapped with the bending region BA, the first region AA1, andthe second region AA2. The bending protection layer BPL may be disposedon a portion of the first region AA1 and a portion of the second regionAA2.

The bending protection layer BPL may be bent, along with the bendingregion BA. The bending protection layer BPL may protect the bendingregion BA from an external impact and may control a stress in thebending region BA.

As shown in FIGS. 7A and 7B, the fifth adhesive layer AL5 may be used toattach the panel protection layer PPL to the barrier layer BRL. Thebarrier layer BRL may be disposed below the panel protection layer PPL.The barrier layer BRL may improve a resistant property to a compressiveforce exerted by a pressure from the outside. Thus, the barrier layerBRL may prevent the display panel DP from being deformed. The barrierlayer BRL may be formed of or include a flexible plastic material (e.g.,polyimide or polyethylene terephthalate). The barrier layer BRL may be acolored film with low optical transmittance. The barrier layer BRL mayabsorb light that is incident thereon from the outside. For example, thebarrier layer BRL may be a black plastic film. In case that a user seesthe display device DD through a window protection layer PF, the user maynot visually recognize elements disposed below the barrier layer BRL.

The sixth adhesive layer AL6 may be used to attach the barrier layer BRLto the support layer PLT. The sixth adhesive layer AL6 may include afirst portion AL6-1 and a second portion AL6-2, which are spaced apartfrom each other.

In the embodiment, the first portion AL6-1 and the second portion AL6-2may be two different portions of a single adhesive layer, but thedisclosure is not limited thereto. In an embodiment, the first portionAL6-1 may be defined as an adhesive layer (e.g., a first adhesivelayer), whereas the second portion AL6-2 may be defined as anotheradhesive layer (e.g., a second adhesive layer).

The support layer PLT may be disposed below the barrier layer BRL. Thesupport layer PLT may be used to support elements disposed thereon andto maintain the display device DD in one of the unfolded and foldedstates. The support layer PLT may include a first supporting portionPLT-1 corresponding to the first non-folding region NFA10 and a secondsupporting portion PLT-2 corresponding to the second non-folding regionNFA20. The first and second supporting portions PLT-1 and PLT-2 may bespaced apart from each other in the second direction DR2.

In the embodiment, the support layer PLT may further include a foldingportion PLT-F in which openings OP are defined, and the folding portionPLT-F may be disposed in a region, which is located between the firstand second supporting portions PLT-1 and PLT-2 and corresponds to thefolding region FA0. The folding portion PLT-F may prevent acontamination material or foreign substances from entering a portion ofthe barrier layer BRL which is placed between the first and secondsupporting portions PLT-1 and PLT-2 and is opened during the foldingoperation. In an embodiment, the folding portion PLT-F may be omitted.

The first and second supporting portions PLT-1 and PLT-2 may be formedof or include at least one of materials which are selected to allow forloss-free or loss-less transmission of a magnetic field produced by adigitizer DTM which will be described below. The first and secondsupporting portions PLT-1 and PLT-2 may be formed of or include at leastone of non-metallic materials. For example, the first and secondsupporting portions PLT-1 and PLT-2 may be formed of or include at leastone of plastic materials and reinforced fibers. In an embodiment, thefirst and second supporting portions PLT-1 and PLT-2 may be formed of orinclude a same material.

Openings OP may be defined in a region of the support layer PLTcorresponding to the folding region FA0. The flexibility of the supportlayer PLT may be improved by virtue of the presence of the openings OP.Since the sixth adhesive layer AL6 is not disposed in a regioncorresponding to the folding region FA0, the flexibility of the supportlayer PLT may be improved.

The cover layer SCV and the digitizer DTM may be disposed below thesupport layer PLT. The cover layer SCV may be disposed to be overlappedwith the folding region FA0. The digitizer DTM may include a firstdigitizer DTM-1 and a second digitizer DTM-2, which are respectivelyoverlapped with the first supporting portion PLT-1 and the secondsupporting portion PLT-2. A portion of each of the first and seconddigitizers DTM-1 and DTM-2 may be disposed below the cover layer SCV.

The seventh adhesive layer AL7 may be used to attach the support layerPLT to the cover layer SCV, and the eighth adhesive layer AL8 may beused to attach the cover layer SCV to the digitizer DTM. The seventhadhesive layer AL7 may include a first portion AL7-1, which is used toattach the first supporting portion PLT-1 to the first digitizer DTM-1,and a second portion AL7-2, which is used to attach the secondsupporting portion PLT-2 to the second digitizer DTM-2.

The cover layer SCV may be disposed between the first portion AL7-1 andthe second portion AL7-2 in the second direction DR2. To preventinterference with the digitizer DTM in the unfolded state, the coverlayer SCV may be spaced apart from the digitizer DTM. A sum ofthicknesses of the cover layer SCV and the eighth adhesive layer AL8 maybe smaller than a thickness of the seventh adhesive layer AL7.

The cover layer SCV may cover (or overlap) the openings OP, which isdefined in the support layer PLT. The cover layer SCV may have anelastic modulus lower than that of the support layer PLT. For example,the cover layer SCV may be formed of or include at least one ofthermoplastic polyurethane, rubber, and silicon, but the disclosure isnot limited to this example.

The digitizer DTM may be referred to as an EMR sensing panel (orelectromagnetic resonance sensing panel) and may include loop coils,which produce a magnetic field allowing for resonance with an electronicpen at a predetermined resonance frequency. The magnetic field producedby the loop coil may be applied to an LC resonance circuit which iscomposed of an inductor (for example, a coil) and a capacitor of theelectronic pen. In case that the magnetic field is applied to the coil,a current flowing through the coil may be produced and may be deliveredto the capacitor. Accordingly, the capacitor may be charged with thecurrent delivered from the coil, and the charged current may bedischarged to the coil. For example, the coil may emit the magneticfield of the resonance frequency. The magnetic field emitted by theelectronic pen may be absorbed again by the loop coil of the digitizerDTM, and in this case, the digitizer DTM may determine a distance of theelectronic pen from a touch screen.

The digitizer DTM may include the first digitizer DTM-1 and the seconddigitizer DTM-2. The first and second digitizers DTM-1 and DTM-2 may bedisposed to be spaced apart from each other by a specific gap GP. Thegap GP may range from about 0.3 mm to about 3 mm and may be disposed tocorrespond to the folding region FA0. The digitizer DTM will bedescribed in more detail below.

The metal layer ML may be disposed below the digitizer DTM. The metallayer ML may include a first metal layer ML1 and a second metal layerML2 which are respectively overlapped with the first supporting portionPLT-1 and the second supporting portion PLT-2. The metal layer ML maydissipate heat, which is produced during the operation of the digitizerDTM, to the outside. The metal layer ML may be used to transfer heat,which is produced in the digitizer DTM, to elements disposed therebelow.The metal layer ML may have an electric conductivity and a thermalconductivity that are higher than those of a metal plate to be describedbelow. The metal layer ML may be formed of or include copper oraluminum.

The ninth adhesive layer AL9 may be used to attach the digitizer DTM tothe metal layer ML. The ninth adhesive layer AL9 may include a firstportion AL9-1 and a second portion AL9-2 corresponding to the firstmetal layer ML1 and the second metal layer ML2.

The metal plate MP may be disposed below the metal layer ML. The metalplate MP may include a first metal plate MP1 and a second metal plateMP2, which are respectively overlapped with the first metal layer ML1and the second metal layer ML2. The metal plate MP may absorb anexternal impact in an upward direction.

The metal plate MP may have a strength (e.g., mechanical strength) and athickness that are greater than those of the metal layer ML. The metalplate MP may be formed of or include a metallic material (e.g.,stainless steel).

The tenth adhesive layer AL10 may be used to attach the metal layer MLto the metal plate MP. The tenth adhesive layer AL10 may include a firstportion AL10-1 and a second portion AL10-2 respectively corresponding tothe first metal plate MP1 and the second metal plate MP2.

The heat-dissipation layer HRP may be disposed below the metal plate MP.The heat-dissipation layer HRP may include a first heat-dissipationlayer HRP1 and a second heat-dissipation layer HRP2, which arerespectively overlapped with the first metal plate MP1 and the secondmetal plate MP2. The heat-dissipation layer HRP may be configured todissipate heat generated from underlying electronic components. Theelectronic components may be or include the electronic module EM shownin FIGS. 2A and 2B. The heat-dissipation layer HRP may have a structure,in which adhesive and graphite layers are alternatively stacked. Theoutermost one of the adhesive layers may be attached to the metal plateMP.

A magnetic field shielding sheet MSM may be disposed below the metalplate MP. The magnetic field shielding sheet MSM may shield a magneticfield produced by a magnetic element (not shown) disposed therebelow.The magnetic field shielding sheet MSM may prevent the magnetic field,which is produced by the magnetic element, from disturbing the digitizerDTM.

The magnetic field shielding sheet MSM may include multiple portions. Atleast one of the portions may have a different thickness from theothers. The portions may be disposed to correspond with a heightdifference produced by a bracket (not shown) disposed below the displaydevice DD. The magnetic field shielding sheet MSM may have a structure,in which magnetic field shielding layers and adhesive layers arealternatively stacked. A portion of the magnetic field shielding sheetMSM may be directly attached to the metal plate MP.

The penetration hole TA-T may be formed to penetrate some elements ofthe lower member LM. The penetration hole TA-T may be disposed to beoverlapped with the first active region DP-TA of FIG. 2A. As shown inFIG. 7A, the penetration hole TA-T may be formed to penetrate someelement(s) of the lower member LM (e.g., from the fifth adhesive layerAL5 to the metal plate MP). The penetration hole TA-T may be an emptyregion, which is formed by removing light-blocking elements located on apropagation path of an optical signal, and thus, the efficiency in anoptical signal receiving operation of the electro-optical module ELM maybe improved by the penetration hole TA-T.

FIG. 8 is a schematic perspective view illustrating the support layerPLT according to an embodiment of the disclosure.

Referring to FIG. 8 , the support layer PLT may be divided into thefirst supporting portion PLT-1, the folding portion PLT-F, and thesecond supporting portion PLT-2, which are arranged in the seconddirection DR2. Openings OP may be defined in the folding portion PLT-F.

The support layer PLT may be formed of or include at least one ofnonmetallic materials (e.g., reinforced fiber composite and plasticmaterials).

FIG. 9A is a schematic perspective view illustrating a portion of thesupport layer PLT according to an embodiment of the disclosure. FIG. 9Bis a schematic perspective view illustrating a reinforced fiberaccording to an embodiment of the disclosure. FIG. 9C is a schematicperspective view illustrating a portion of the support layer PLTaccording to an embodiment of the disclosure.

FIG. 9A illustrates an enlarged shape of portion AA of the support layerPLT shown in FIG. 8 .

Referring to FIGS. 8 and 9A, the support layer PLT may include areinforced fiber FB. In an embodiment, the support layer PLT may beformed of a reinforced fiber composite including reinforced fibers. Thesupport layer PLT, which is formed to include the reinforced fibercomposite, may further include a matrix MX. In an embodiment, thereinforced fibers FB may be arranged or distributed in the matrix MX.

The reinforced fiber FB may be a carbon fiber or a glass fiber. Thematrix MX may be formed to include a polymer resin. The matrix MX may beformed of a thermoplastic resin. For example, the matrix MX may beformed of or include at least one of polyamide-based resins andpolypropylene-based resins. In an embodiment, the reinforced fibercomposite may be a carbon fiber reinforced plastic (CFRP) or a glassfiber reinforced plastic (GFRP).

The support layer PLT of the electronic device ED may be formed of orinclude a nonmetallic material including a reinforced fiber composite.In case that the support layer PLT includes the reinforced fibercomposite, the magnetic field, which is produced by the digitizer DTMdisposed below the support layer PLT, may not be affected by the supportlayer PLT. For example, since the electronic device ED includes thesupport layer PLT including the reinforced fiber composite and thedigitizer DTM disposed below the support layer PLT, the digitizer DTMmay have improved sensing sensitivity.

It may be possible to reduce a weight of the electronic device ED,because the support layer PLT includes the reinforced fiber composite.In an embodiment, since the support layer PLT includes the reinforcedfiber composite, the support layer PLT may have a small or reducedweight and may have similar values of modulus and mechanical strength toa metal plate, compared with the case that the support layer PLT isformed of a metallic material. Accordingly, the electronic deviceaccording to an embodiment of the disclosure may have a reduced weightand improved mechanical and reliability properties, compared with thecase that a metal supporting plate is used.

Furthermore, in case that the matrix MX includes a polymer resin, theshape of the support layer PLT may be easily processed compared to ametal plate. For example, the shape of the support layer PLT includingthe reinforced fiber composite may be processed using a laser cuttingprocess. Openings OP, which will be described with reference to FIG. 10,may be defined in the support layer PLT by the laser cutting process.

The reinforced fiber FB may be extended in a direction, and in anembodiment, reinforced fibers FB may be arranged in parallel to eachother in a direction, for example, a long axis direction LX. The longaxis direction LX or an extension direction of the reinforced fiber FBmay correspond to a machine direction MD in a process of forming thereinforced fiber composite. The machine direction MD may be referred toas a longitudinal direction and a direction perpendicular to the machinedirection MD may be referred to as a transverse direction (TD).

In an embodiment, the support layer PLT may have a folding axis FX thatis parallel to the extension direction or the long axis direction LX ofthe reinforced fiber FB. In other words, the support layer PLT may be aplate, which is elongated in the direction of the folding axis FX, or inwhich the long axis of the reinforced fiber FB is parallel to thefolding axis FX.

In an embodiment, each of the reinforced fibers FB, which are includedin the support layer PLT, may be composed of a single strand.Furthermore, in an embodiment, the reinforced fiber FB, which isincluded in the support layer PLT, may be a single strand that iselongated in the machine direction MD.

In an embodiment, the structure of the reinforced fiber compositeincluded in the support layer PLT may be different from that shown inFIG. 9A. Referring to FIG. 9B, a reinforced fiber FB-a included in thesupport layer PLT may be composed of sub-fibers S-FB. For example, thesub-fibers S-FB may be grouped to form a single strand of the reinforcedfiber FB-a.

Referring to FIG. 9C, a reinforced fiber FB-b, which is included in thesupport layer PLT, may not be continuously extended in the machinedirection MD. For example, a length of the reinforced fiber FB-b in thelong axis direction LX may be shorter than that of the reinforced fiberFB shown in FIG. 9A. In an embodiment shown in FIG. 9C, all of thereinforced fibers FB-b may have a long axis that is parallel to themachine direction MD. The reinforced fibers FB-b may be arranged ordistributed in the matrix MX.

FIG. 10 is a schematic plan view illustrating a portion of the supportlayer PLT according to an embodiment of the disclosure.

FIG. 10 illustrates an enlarged structure of portion BB of the supportlayer PLT shown in FIG. 8 .

Referring to FIGS. 8 and 10 , openings OP may be defined in the foldingportion PLT-F, and in this case, flexibility of the folding portionPLT-F may be improved. Since the support layer PLT is formed of thereinforced fiber composite, the opening OP may be easily patterned,compared to the case that the support layer PLT includes a metallicmaterial.

FIG. 11A is a schematic plan view illustrating the digitizer DTMaccording to an embodiment of the disclosure. FIG. 11B is a schematicplan view illustrating a sensing region SA1 of the digitizer DTMaccording to an embodiment. FIG. 11C is a schematic cross-sectional viewillustrating the sensing region SA1 of the digitizer DTM according to anembodiment of the disclosure.

As shown in FIG. 11A, the digitizer DTM may include the first digitizerDTM-1 and the second digitizer DTM-2, which are spaced apart from eachother. A first flexible circuit film FCB1 and a second flexible circuitfilm FCB2 may be respectively and electrically connected to the firstand second digitizers DTM-1 and DTM-2. The first and second flexiblecircuit films FCB1 and FCB2 may be electrically connected to a samecircuit board. Each of the first and second flexible circuit films FCB1and FCB2 may be electrically connected to a main circuit board to whichthe flexible circuit film FCB described in FIG. 2A is electricallyconnected. The first and second flexible circuit films FCB1 and FCB2 maybe replaced with a single circuit film.

The first digitizer DTM-1 and the second digitizer DTM-2 may include afirst sensing region SA1 and a second sensing region SA2, respectively,and may include a first non-sensing region NSA1 and a second non-sensingregion NSA2, respectively. The first non-sensing region NSA1 and thesecond non-sensing region NSA2 may be disposed adjacent to the firstsensing region SA1 and the second sensing region SA2, respectively. Thefirst and second digitizers DTM-1 and DTM-2 may have substantially asame structure, and thus, the first digitizer DTM-1 may be mainlydescribed below.

As shown in FIG. 11B, first loop coils 510 (hereinafter referred to asfirst coils) and second loop coils 520 (hereinafter referred to assecond coils) may be provided in the first sensing region SA1. The firstcoils 510 and the second coils 520 may be referred to as driving coilsand sensing coils, respectively, but the disclosure is not limitedthereto. For example, the first coils 510 and the second coils 520 maybe used as the sensing coils and the driving coils, respectively.

The first coils 510 may be arranged in the first direction DR1 and maybe extended in the second direction DR2. The second coils 520 may beextended in the first direction DR1 and may be arranged to be spacedfrom each other in the second direction DR2. Unlike those shown in FIG.11B, the first coils 510 may be arranged such that adjacent ones of themare overlapped with each other. A bridge pattern may be disposed in anintersection region of the first coils 510. The second coils 520 may bearranged such that adjacent ones of them are overlapped with each other.A bridge pattern may be disposed in an intersection region of the secondcoils 520.

Alternating current (AC) signals may be sequentially provided to firstterminals 510 t of the first coils 510. The other terminals of the firstcoils 510, which are electrically connected to the first terminals 510t, may be grounded. Although not shown in FIG. 11B, signal lines may beelectrically connected to the first terminals 510 t of the first coils510, respectively. The signal lines may be disposed in the firstnon-sensing region NSA1 shown in FIG. 11A.

In case that a current flows through the first coils 510, magnetic fieldlines may be induced between the first coils 510 and the second coils520. The second coils 520 may output a sensing signal, which is producedby sensing an electromagnetic force induced by an electronic pen, tosecond terminals 520 t of the second coils 520. The other terminals ofthe second coils 520, which are electrically connected to the secondterminals 520 t, may be grounded. Although not shown in FIG. 11B, signallines may be electrically connected to the second terminals 520 t of thesecond coils 520, respectively. The signal lines may be disposed in thefirst non-sensing region NSA1 shown in FIG. 11A.

As shown in FIG. 11C, the first digitizer DTM-1 may include a base layerBL, the first coils 510 disposed on a surface of the base layer BL, andthe second coils 520 disposed on an opposite surface of the base layerBL. The base layer BL may include a plastic film (e.g., a polyimidefilm). The first coils 510 and the second coils 520 may be formed of orinclude at least one of metallic materials (e.g., gold (Au), silver(Ag), copper (Cu), or aluminum (Al)).

A protection layer may be disposed on opposite surfaces of the baselayer BL to protect the first coils 510 and the second coils 520. In theembodiment, the protection layer may include a first protection layerPL-D1 which is disposed on the first coils 510 and is attached to thebase layer BL by a first adhesive layer AL-D1, and a second protectionlayer PL-D2, which is disposed on the second coils 520 and is attachedto the base layer BL by a second adhesive layer AL-D2. Each of the firstprotection layer PL-D1 and the second protection layer PL-D2 may beformed of or include a plastic material and may include, for example, apolyimide film.

As another example, a planarization layer (not shown) may be furtherdisposed on the first protection layer PL-D1. Since the planarizationlayer is further provided, it may be possible to remove an unevenportion from the top surface of the digitizer DTM. A planarization layermay include at least one of a resin layer and an adhesive layer.

As described above, the first and second supporting portions PLT-1 andPLT-2 may include the reinforced fibers. Accordingly, a magnetic fieldproduced by the digitizer DTM may pass through the support layer PLT,without a reduction in its intensity. The digitizer DTM disposed belowthe support layer PLT may sense an external input. In case that ametal-containing support layer is disposed on the digitizer DTM, amagnetic field generated by the digitizer DTM may be affected by themetallic material in the support layer, and this may lead to a sensingfailure in the digitizer DTM. By contrast, according to an embodiment ofthe disclosure, since the nonmetallic support layer PLT is disposed onthe digitizer DTM, the sensitivity of the digitizer DTM may bemaintained to an excellent level.

Although the lower member LM of FIGS. 8 to 11C is illustrated to have astructure, in which the penetration hole TA-T is not provided, thepenetration hole TA-T may be formed to be overlapped with the firstdisplay region TA, as described with reference to FIG. 7A.

Concretely, the penetration hole TA-T may be formed in a portion of thesupport layer PLT (e.g., one of the first and second supporting portionsPLT-1 and PLT-2). For example, the penetration hole TA-T may be formedin the first supporting portion PLT-1.

Concretely, the penetration hole TA-T may be formed in a portion of thedigitizer DTM (e.g., one of the first and second digitizers DTM-1 andDTM-2). For example, the penetration hole TA-T may be formed in thefirst digitizer DTM-1.

In an embodiment, the electronic device may include the damping layer,and in this case, an impact-resistant property of the electronic devicemay be improved.

In an embodiment, the electronic device may be configured to have thedamping layer and the fourth adhesive layer having a specific thicknessrange, and this may make it possible to reliably execute the foldingoperation of the electronic device at low temperatures.

In an embodiment, the electronic device may include the support layerand the digitizer disposed below the support layer. Here, the supportlayer may be formed of or include a nonmetallic material, and in thiscase, it may be possible to improve the sensing sensitivity of thedigitizer.

According to an embodiment of the disclosure, a display device mayinclude a digitizer with improved sensing sensitivity.

According to an embodiment of the disclosure, a foldable display devicemay have an improved impact-resistant property.

According to an embodiment of the disclosure, a foldable display devicemay have high reliability even at low temperatures.

While example embodiments of the disclosure have been particularly shownand described, it will be understood by one of ordinary skill in the artthat variations in form and detail may be made therein without departingfrom the spirit and scope of the attached claims.

What is claimed is:
 1. A display device comprising: a window module; anda display module including a first non-folding region, a secondnon-folding region, and a folding region disposed between the firstnon-folding region and the second non-folding region, wherein thedisplay module comprises: a damping layer; a color filter layer; adisplay panel; and a lower member, the damping layer, color filterlayer, display panel, and lower member are sequentially stacked belowthe window module, and the damping layer comprises polymer.
 2. Thedisplay device of claim 1, wherein a thickness of the damping layer isin a range of about 5 μm to about 30 μm.
 3. The display device of claim1, wherein the window module comprises: a window protection layer; and athin glass substrate.
 4. The display device of claim 3, wherein amodulus value of the damping layer is smaller than a modulus value ofthe window protection layer.
 5. The display device of claim 1, furthercomprising: an upper adhesive layer, which is disposed directly on abottom surface of the damping layer, wherein a thickness of the upperadhesive layer is in a range of about 40 μm to about 60 μm.
 6. Thedisplay device of claim 1, further comprising: a panel protection layerdisposed below the display panel; and a lower adhesive layer attachingthe panel protection layer to the display panel, wherein a thickness ofthe lower adhesive layer is in a range of about 20 μm to about 30 μm. 7.The display device of claim 1, wherein the lower member comprises asupport layer including a nonmetal and a digitizer disposed below thesupport layer.
 8. The display device of claim 7, wherein the nonmetal isa reinforced fiber.
 9. The display device of claim 1, wherein thedamping layer comprises at least one of polyimide, polycarbonate,polyamide, triacetylcellulose, polymethylmethacrylate, and polyethyleneterephthalate.
 10. The display device of claim 1, wherein the lowermember includes a penetration hole that overlaps at least one of thefirst non-folding region and the second non-folding region in a planview, and the display panel overlaps the penetration hole in a planview.
 11. The display device of claim 1, further comprising an inputsensor disposed between the color filter layer and the display panel.12. A display device comprising: a display panel including: a firstnon-folding region; a second non-folding region; and a folding region; acolor filter layer disposed on the display panel, the color filter layercomprising: color filter patterns; and a division pattern; a dampinglayer disposed on the color filter layer, the damping layer comprisingpolymer; and a lower member disposed below the display panel.
 13. Thedisplay device of claim 12, wherein the lower member includes apenetration hole that overlaps at least one of the first non-foldingregion and the second non-folding region in a plan view, and the displaypanel overlaps the penetration hole in a plan view.
 14. The displaydevice of claim 12, wherein the lower member comprises: a panelprotection layer disposed below the display panel; a support layerdisposed below the panel protection layer, the support layer comprisinga nonmetal; and a digitizer disposed below the support layer.
 15. Thedisplay device of claim 14, wherein the nonmetal is a reinforced fiber.16. The display device of claim 12, wherein a thickness of the dampinglayer is in a range of about 5 μm to about 30 μm.
 17. An electronicdevice comprising: a display device including: a first display regionallowing for transmission of an optical signal; a second display regionadjacent to the first display region; and a peripheral region adjacentto the second display region; and an electro-optical module disposedbelow the display device and overlapping the first display region in aplan view, the electro-optical module receiving the optical signal,wherein the display device comprises: a window module; and a displaymodule including: a first non-folding region; a second non-foldingregion; and a folding region disposed between the first non-foldingregion and the second non-folding region, the display module comprises:a damping layer; a color filter layer; a display panel; and a lowermember, the damping layer, color filter layer, display panel, and lowermember are sequentially stacked below the window module, and the dampinglayer comprises polymer.
 18. The electronic device of claim 17, whereinthe color filter layer comprises: color filter patterns; and a divisionpattern.
 19. The electronic device of claim 17, wherein a thickness ofthe damping layer is in a range of about 5 μm to about 30 μm.
 20. Theelectronic device of claim 17, wherein the electro-optical modulecomprises a camera module.